1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Very small package size
- Zero reverse recovery charge
100V Enhancement-mode GaN Power Transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in Solder Ball WLCSP with 3.5 mm x 2.13 mm package size.
| Parameter | Value |
|---|---|
| VDS,max | 100V |
| RDS(on),max @ VGS = 5V | 3.2mΩ |
| QG,typ @ VDS = 50V | 9.2nC |
| ID,pulse | 230A |
| QOSS @ VDS = 50V | 50nC |

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