| Platform (  INN650D080BS/INN700D080BS) | 
|---|
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result | 
|---|
| HTRB | T=150°C, VDS= 560V, 1000hrs | 77 x 3 | 0 Fail | Pass | 
| HTGB | T=150°C, VGS= 7V, 1000hrs | 77 x 3 | 0 Fail | Pass | 
| *HTGB(-) | T=150°C, VGS= -6V, 1000hrs | 77 x 3 | 0 Fail | Pass | 
| TC | -55 to +150°C, Air, 1000Cys | 77 x 3 | 0 Fail | Pass | 
| HAST | T=130°C, RH=85%, VDS=100V, 96hrs | 77 x 3 | 0 Fail | Pass | 
| H3TRB | T=85°C, RH=85%, VDS=560V, 1000hrs | 77 x 3 | 0 Fail | Pass | 
| MSL3 | T=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass | 
| HBM | All Pins | 3 x 1 | 0 Fail | Class 2 | 
| CDM | All Pins | 3 x 1 | 0 Fail | Class C3 | 
| HTOL (LLC) | Tj=125°C, Input: 220 Vac, Vout=48V, Vplat=400V, fsw=130KHz | 10 x 3 | 0 Fail | Pass | 
| HTOL(QR-PFC) | Tj=125°C, Input: 90 Vac, Output: 20V/6.5A, F=120KHz(QR)/100KHz(PFC) | 10 x 3 | 0 Fail | Pass | 
| Note:*HTGB(-)was optional test item for device with bidirectional ESD design. | 
| Spin-off Product | 
|---|
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result | 
|---|
| HTRB | T=150°C, VDS= 560V, 168hrs | 77 x 1 | 0 Fail | Pass | 
| HTGB | T=150°C, VGS= 7V, 168hrs | 77 x 1 | 0 Fail | Pass | 
| New Package Type Qualification test | 
|---|
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result | 
|---|
| TC | -55 to +150°C, Air, 1000Cys | 77 x 3 | 0 Fail | Pass | 
| HAST | T=130°C, RH=85%, VDS=100V, 96hrs | 77 x 3 | 0 Fail | Pass | 
| H3TRB | T=85°C, RH=85%, VDS=560V, 1000hrs | 77 x 3 | 0 Fail | Pass | 
| MSL3 | T=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass | 
| Note: Package type Spin off have the same package process and design rules |