1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Very small footprint
100V Enhancement-mode GaN Power Transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in FCQFN with 3.0 mm x 5.0 mm package size.
| Platform (S100E2.0) | ||||
|---|---|---|---|---|
| Product (INN100FQ025A) | ||||
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
| MSL3 | T=30°C, RH=60%, 3 x reflow | 25 x 3 | 0 Fail | Pass |
| HTRB | T=150°C, VD=80V | 77 x 1 | 0 Fail | Pass |
| HTGB | T=150°C, VG=5.5V | 77 x 1 | 0 Fail | Pass |
| PLTC | -55℃to +150℃ | 77 x 3 | 0 Fail | Pass |
| H3TRB | T=85°C, RH=85%, VD=80V/120V | 77 x 3 | 0 Fail | Pass |
| HAST | T=130°C, RH=85%, VD=42V | 77 x 3 | 0 Fail | Pass |
| HTSL | T=150°C | 77 x 3 | 0 Fail | Pass |
| Solderability | 1.Precondition : 8H 2. Pb-feee,245±5℃,5±0.5S. |
10 x 1 | 0 Fail | Pass |
| HBM | All Pins | 3 x 1 | 0 Fail | Class 2 |
| CDM | All Pins | 3 x 1 | 0 Fail | Class C3 |
| Parameter | Value |
|---|---|
| VDS,max | 100V |
| RDS(on),max @ VG = 5 V | 2.8mΩ |
| QG,typ @ VDS = 50 V | 14nC |
| ID,DC | 320A |
| QOSS @ VDS = 50 V | 85nC |