1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Very small footprint
100V Enhancement-mode GaN Power transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in FCQFN with 4.0 mm x 6.0 mm package size.
| Platform (S100E2.0) | ||||
|---|---|---|---|---|
| Product (INN100FQ016A) | ||||
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result | 
| MSL3 | T=30°C, RH=60%, 3 x reflow | 0 Fail | 25 x 3 | Pass | 
| HTRB | T=150°C, VD=80V | 0 Fail | 77 x 1 | Pass | 
| HTGB | T=150°C, VG=5.5V | 0 Fail | 77 x 1 | Pass | 
| PLTC | -55℃to +150℃ | 0 Fail | 77 x 3 | Pass | 
| H3TRB | T=85°C, RH=85%, VD=80V/120V | 0 Fail | 77 x 3 | Pass | 
| HAST | T=130°C, RH=85%, VD=42V | 0 Fail | 77 x 3 | Pass | 
| HTSL | T=150°C | 0 Fail | 77 x 3 | Pass | 
| Solderability | 1.Precondition : 8H 2. Pb-feee,245±5℃,5±0.5S. | 0 Fail | 10 x 1 | Pass | 
| HBM | All Pins | 0 Fail | 3 x 1 | Class 2 | 
| CDM | All Pins | 0 Fail | 3 x 1 | Class C3 | 
 
						
						| Parameter | Value | 
|---|---|
| VDS,max | 100V | 
| RDS(on),max @ VGS = 5 V | 1.8mΩ | 
| QG,typ @ VDS = 50 V | 22nC | 
| ID,pulse | 320A | 
| QOSS @ VDS = 50 V | 125nC | 
