1.1 Features
- GaN-on-Silicon E-mode HEMT technology
- Very low gate charge
- Ultra-low on resistance
- Zero reverse recovery charge
- Exposed die for top‑side thermal optimization
30V Enhancement-mode GaN Power Transistor
GaN-on-Silicon enhancement mode high-electron-mobility-transistor (HEMT) in En-FCQFN with 5 mm x 4 mm package size.
| Platform (S040E2.5) | ||||
|---|---|---|---|---|
| Product (INN030FQ015A) | ||||
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
| MSL3 | Ta=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 1 | 0 Fail | Pass |
| H3TRB | Ta=85°C, RH=85%, VD=24V, 1000hrs | 77 x 1 | 0 Fail | Pass |
| HAST | T=130°C, RH=85%, VD=24V, 96hrs | 77 x 1 | 0 Fail | Pass |
| TC | -40 to +125°C, Air, 1000Cys | 77 x 1 | 0 Fail | Pass |
| HBM | All Pins | 3 x 1 | 0 Fail | Class 1B |
| CDM | All Pins | 3 x 1 | 0 Fail | Class 2a |
| Parameter | Value |
|---|---|
| VDS,max | 30V |
| RDS(on),max @ VG = 5 V | 1.5mΩ |
| QG,typ @ VDS = 15 V | 22.8nC |
| ID, Pulse | 300A |
| QOSS@ VDS = 15V | 43nC |