1.1 特性
- 硅基GaN E型HEMT技术
- 极低栅极电荷
- 超低导通电阻
- 零反向恢复
- 顶部散热优化
30V 增强型GaN功率晶体管
基于先进的GaN技术的30V硅基氮化镓增强型高电子迁移率晶体管,采用En-FCQFN 5mmX4mm 封装。
| Platform (S040E2.5) | ||||
|---|---|---|---|---|
| Product (INN030FQ015A) | ||||
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
| MSL3 | Ta=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 1 | 0 Fail | Pass |
| H3TRB | Ta=85°C, RH=85%, VD=24V, 1000hrs | 77 x 1 | 0 Fail | Pass |
| HAST | T=130°C, RH=85%, VD=24V, 96hrs | 77 x 1 | 0 Fail | Pass |
| TC | -40 to +125°C, Air, 1000Cys | 77 x 1 | 0 Fail | Pass |
| HBM | All Pins | 3 x 1 | 0 Fail | Class 1B |
| CDM | All Pins | 3 x 1 | 0 Fail | Class 2a |