1.1 特性
- 硅基GaN E型HEMT技术
- 满足工业应用
- 极低的栅极电荷
- 超低导通电阻
- 超小占板面积
100V增强型GaN功率晶体管
基于先进GaN技术的100V硅基氮化镓增强型高电子迁移率晶体管,采用En-FCLGA 3.3 mm x 3.3mm 封装。
| Platform (S100E3.0I) | ||||
|---|---|---|---|---|
| Product (INN100EA035A) | ||||
| Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
| HTRB | T=150°C, VD=100V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| LTRB | T=-40°C, VD=100V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| HTGB | T=150°C, VG=6V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| HTGB- | T=150°C, VG=-4V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| LTGB | T=-40°C, VG=6V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| LTGB- | T=-40°C, VG=-4V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| ESD-HBM | T=25°C, All pin | 10 x 1 | 0 Fail | Class 1B |
| ESD-CDM | T=25°C, All pin | 10 x 1 | 0 Fail | Class C2a |
| DHTOL | Hard switching, T=125°C, 100KHz, VD=80V, 1000hrs | 8set x 1 | 0 Fail | Pass |
| Hard switching, T=125°C, 600KHz, VD=80V, 1000hrs | 8set x 2 | 0 Fail | Pass | |
| Soft Switching, T=125°C, 500KHz, VD=80V, 1000hrs | 8set x 1 | 0 Fail | Pass | |
| Soft Switching, T=125°C, 1.5MHz, VD=80V, 1000hrs | 8set x 2 | 0 Fail | Pass | |
| MSL3 | T=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass |
| H3TRB | T=85°C, RH=85%, VD=80V, 1000hrs | 77 x 3 | 0 Fail | Pass |
| PLTC | -55 to +150°C, Air, 1000Cycles | 77 x 3 | 0 Fail | Pass |
| uHAST | T=130°C, RH=85% | 77 x 3 | 0 Fail | Pass |
| IOL | ΔTj ≥ 125℃; ton / toff = 1 min /5 min, 5000 Cycles | 77 x 3 | 0 Fail | Pass |
| RSH | T=125°C bake 24hrs, T=30°C RH=60% soak 192hrs, 260±5℃, 10±1s | 30 x 1 | 0 Fail | Pass |
| Solderability | Precondition Condition C (8hrs), Pb-free:245±5℃, 5±0.5s | 10 x 1 | 0 Fail | Pass |