1.1 特性
- 硅基GaN E型HEMT技术
- 满足工业应用
- 极低的栅极电荷
- 超低导通电阻
- 超小占板面积
100V增强型GaN功率晶体管
基于先进GaN技术的100V硅基氮化镓增强型高电子迁移率晶体管,采用En-FCLGA 3.3 mm x 3.3mm 封装。
Platform (S100E3.0I) | ||||
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Product (INN100EA035A) | ||||
Test Items | Test Conditions | Sample Size (Unit x Lot) | #Fail | Result |
HTRB | T=150°C, VD=100V, 1000hrs | 77 x 3 | 0 Fail | Pass |
LTRB | T=-40°C, VD=100V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTGB | T=150°C, VG=6V, 1000hrs | 77 x 3 | 0 Fail | Pass |
HTGB- | T=150°C, VG=-4V, 1000hrs | 77 x 3 | 0 Fail | Pass |
LTGB | T=-40°C, VG=6V, 1000hrs | 77 x 3 | 0 Fail | Pass |
LTGB- | T=-40°C, VG=-4V, 1000hrs | 77 x 3 | 0 Fail | Pass |
ESD-HBM | T=25°C, All pin | 10 x 1 | 0 Fail | Class 1B |
ESD-CDM | T=25°C, All pin | 10 x 1 | 0 Fail | Class C2a |
DHTOL | Hard switching, T=125°C, 100KHz, VD=80V, 1000hrs | 8set x 1 | 0 Fail | Pass |
Hard switching, T=125°C, 600KHz, VD=80V, 1000hrs | 8set x 2 | 0 Fail | Pass | |
Soft Switching, T=125°C, 500KHz, VD=80V, 1000hrs | 8set x 1 | 0 Fail | Pass | |
Soft Switching, T=125°C, 1.5MHz, VD=80V, 1000hrs | 8set x 2 | 0 Fail | Pass | |
MSL3 | T=30°C, RH=60%, 3 x reflow, 192hrs | 25 x 3 | 0 Fail | Pass |
H3TRB | T=85°C, RH=85%, VD=80V, 1000hrs | 77 x 3 | 0 Fail | Pass |
PLTC | -55 to +150°C, Air, 1000Cycles | 77 x 3 | 0 Fail | Pass |
uHAST | T=130°C, RH=85% | 77 x 3 | 0 Fail | Pass |
IOL | ΔTj ≥ 125℃; ton / toff = 1 min /5 min, 5000 Cycles | 77 x 3 | 0 Fail | Pass |
RSH | T=125°C bake 24hrs, T=30°C RH=60% soak 192hrs, 260±5℃, 10±1s | 30 x 1 | 0 Fail | Pass |
Solderability | Precondition Condition C (8hrs), Pb-free:245±5℃, 5±0.5s | 10 x 1 | 0 Fail | Pass |